HTC DOUBLE S SEG 16/20 MEDIUM BOND
by SYNTEC
Original price
$32.40
-
Original price
$32.40
Original price
$32.40
$32.40
-
$32.40
Current price
$32.40
The HTC DOUBLE S SEG 16/20 is a premium diamond grinding segment designed for concrete floor preparation and polishing. Featuring a double-segment configuration, it provides efficient material removal and superior surface finish. Ideal for use with HTC grinding machines, it ensures high performance and durability in both residential and commercial applications.