Skip to content

HTC DOUBLE S SEG 16/20 MEDIUM BOND

by SYNTEC
Original price $32.40 - Original price $32.40
Original price
$32.40
$32.40 - $32.40
Current price $32.40

The HTC DOUBLE S SEG 16/20 is a premium diamond grinding segment designed for concrete floor preparation and polishing. Featuring a double-segment configuration, it provides efficient material removal and superior surface finish. Ideal for use with HTC grinding machines, it ensures high performance and durability in both residential and commercial applications.

Compare products

{"one"=>"Select 2 or 3 items to compare", "other"=>"{{ count }} of 3 items selected"}

Select first item to compare

Select second item to compare

Select third item to compare

Compare