SYNTEC DIAMOND HTC DOUBLE X SEG 30GRIT MEDIUM BOND
SYNTEC Diamond HTC Double X Seg 30Grit Medium Bond
Achieve exceptional results with the SYNTEC Diamond HTC Double X Seg 30Grit. Designed for medium bond concrete surfaces, this diamond segment offers superior cutting efficiency and durability. Ideal for grinding and polishing tasks, its double X segmentation ensures a smooth finish and longer lifespan. Perfect for professional use in demanding environments.